SoftBank Group to raise $4.10 billion through bond issuance

Japanese tech investment group, SoftBank (TYO:9984) Group, has announced its intention to raise 600 billion yen ($4.10 billion) by issuing bonds to retail investors, according to a filing on Monday.

The funds raised will be utilized to redeem existing bonds and to offset a portion of the pending payment for the acquisition of shares of chip designer Arm.

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